Advanced Semiconductor Manufacturing and Packaging Testing
Jointly offered by the Program on Semiconductor Manufacturing Technology, the Program on Semiconductor Packaging and Testing
Appropriate level: senior undergraduate and fresh graduate students with a science and engineering background
Meet the Faculty and Instructor
Director Prof. Wen-Dung Hsu, PSPT
Ph.D. of Materials Science and Engineering, University of Florida, Gainesville, USA
Dept. Department of Materials Science and Engineering & Program on Key Materials, NCKU
Area: molecular dynamics simulation/Monte Carlo simulation/first principle simulation/coarse-graining molecular dynamics simulation/nano-materials/carbon based materials/transition metal clusters/nano-tribology/nano-mechanics.
Director Prof.. Wei-Chen Tu, PSMT
PhD, Electronics Engineering, National Taiwan University
Dept. Electrical Engineering & Program on Semiconductor Manufacturing Technology, NCKU
Area: Low dimensional materials and devices/Optical and electrical simulation of nanomaterials and nanodevices /Photodetectors/ Solar cells/Nanoscience and nanotechnology/Applications of quantum dots
【 Nanophotonic devices 】
Lecturer: Prof. Jui-Nung Liu
PhD, Electrical and Computer Engineering, University of Illinois at Urbana-Champaign
Dept. Electrical Engineering and Institute of Microelectronics &Program on Semiconductor Manufacturing Technology, NCKU
Area: Mid-infrared group-IV photonics/Optical nanocavity/ Surface-enhanced vibrational spectroscopy/Cavity QED
Description
This session provides an introduction to nanophotonics based on semiconductors and their device applications. Several important types of optical resonators will be introduced.
【 Semiconductor Fabrication】
Lecturer: Ying-Yuan Huang
PhD, Electrical and Computer Engineering, Georgia Institute of Technology
Dept. Electrical Engineering and Institute of Microelectronics &Program on Semiconductor Manufacturing Technology, NCKU
Area: Microelectronics, Electrical Engineering
Description
Semiconductor Fabrication delves into the heart of the microelectronics industry, focusing on the manufacturing process of semiconductor devices. This session offers students an essential understanding of the steps involved in the fabrication of semiconductors, including material preparation, chemical/physical vapor deposition, photolithography, etching, and ion implantation. Students will gain insight into the sophisticated processes and innovations that enable the production of ever-smaller and more powerful semiconductor devices.
【 Semiconductor Materials】
【 Neural Networks】
Lecturer: Prof. Chao-Hung Wang
PhD, Materials Science and Engineering, NCKU
Miin Wu School of Computing & Program on Semiconductor Manufacturing Technology, National Cheng Kung University
Area: Emerging Non-Volatile Memory Materials and Devices, Neuromorphic Computing Analog Circuit Design, and Neuromorphic Computing Algorithms
Description - Semiconductor Materials
This session introduces the fundamental properties and applications of semiconductor materials. Topics include crystal structures, electronic band theory, charge carriers, doping, and transport phenomena. The course also covers key semiconductor materials such as silicon, compound semiconductors, and emerging materials, along with their roles in electronic and optoelectronic devices. Emphasis is placed on linking material properties to device performance and modern semiconductor technologies.
Description - Neural Networks
This session provides an introduction to neural networks and their fundamental principles. Topics include basic neuron models, network architectures, learning algorithms, and training methods. The course covers multi-layer perceptrons, convolutional neural networks, and deep neural networks, with applications in pattern recognition, signal processing, and artificial intelligence, emphasizing the connection between mathematical foundations and practical implementations.
【 Quantum applications of the defects in semiconductor materials】
Lecturer: Dr. Yu-Chen Chen
PhD, Materials, University of Oxford
Assistant Research Fellow, Academia Sinica
Area: Quantum optics/ Physics
Description
This session will introduce the basic knowledge of various quantum technologies and focus on the quantum aaplications of the defects in semiconductors.
【 Semiconductor Fabrication】
Lecturer: Mr. Albert Lan
Global Sr. Packaging Account TD Head, Applied Materials, USA
Over 30 years of job experience in semiconductor industry, esp. advanced packaging technologies.
Senior Engineering Center Director, 14 years, SPIL
PD, Quality, & Sales, 6 years, Amkor Taiwan
Area: Advanced 3D Heterogeneous Integration Packaging Technology Development
【Vacuum System】
【 Cleanroom Technology】
Description
This session will introduce the basic knowledge of various quantum technologies and focus on the quantum aaplications of the defects in semiconductors.
Lecturer: Mr. Jacy Liao
Master, Electrical Engineering, NCKU
Senior Manager, Global Technical Learning Center, Applied Materials
Area: Semiconductor Ion Implanter, Metal Deposition, Equipment/Process
Description - Vacuum System
This session is designed for those individuals in the semiconductor industry who require the knowledge and
skills to work on the vacuum system.
Agenda:
1. Basic Vacuum Theory
2. Vacuum System Overview
3. Vacuum Pump Introduction
4. Vacuum Gauge Introduction
5. Leak Check Technology
Description - Cleanroom Technology
This session is designed for those individuals in the semiconductor industry who require the knowledge and skills to familiar with Cleanroom Technology.
Agenda:
1. Semiconductor device scaling
2. Particle
3. Cleanroom overview
4. How to protect the devices on wafer -- Wafer transfer/storage/shipping
5. Cleanroom Protocol -- Gowning Practice
【 Lithography & Mask Technology】
Lecturer: Dr. Frederick
PhD, Automation and Control Engineering, NTUST
Process Engineer, Applied Materials
Area: Photolithography, Computational lithography
Description
As technology nodes continue to shrink, advanced lithography techniques play an increasingly essential role in shaping the speed, power efficiency, and complexity of today's chips. Photolithography is a key microfabrication technique that uses light, precision optics, mechanical control, and materials engineering to transfer circuit design patterns onto a wafer.
This session will cover:
1. Introduction of photolithography.
2. Today of photolithography.
【 Latest Innovations and Challenges of Semiconductor Technology for 3nm Node and Beyond 】
Lecturer: Mr. Kevin Hsiao
Material Science & Engineering, NTHU
Technical Project Manager, Applied Materials
Area: Semiconductor fabrication and integration / Logic advanced node development to large scale production project / CVD & ALD process and product development
Description
•Moore’s Law described in 1965 will celebrate its 60th anniversary in 2025. It successfully predicted the economic benefits of continuous semiconductor scaling. We observed its amazing achievements in the past that had dramatically changed the way we live. The recent explosive growth of Artificial Intelligence (AI) requires even more advanced semiconductor technology. Taiwan plays a critical role as hub of semiconductor R&D and manufacturing powerhouse to fulfill the needs.
•In this session, the latest innovation of semiconductor process to drive the success of advanced technology nodes will be described, from transistor structure evolution, to impact and challenges of each process technologies including lithography/deposition / etch / CMP.
•Furthermore, the future challenges and opportunities beyond 3nm nodes to keep Moore’s Law alive, such as Gate-All-Around (GAA) structure, backside power rails, and chiplet heterogeneous integration will also be presented.
【 Applications of Numerical Simulation in the IC Packaging Industry 】
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Lecturer: Dr. Li-Hsuan (Leo) Shen
Ph.D. Civil Engineering, National Taiwan University
Senior Manager of R&D and IC Packaging Product Manager, Moldex3D (CoreTech System Co., Ltd.)
Area: Computational fluid dynamics, Numerical simulation, Structural analysis for IC packaging applications
Description
This session provides an in-depth exploration of the challenges faced in IC packaging, focusing on innovative solutions by applying mechanical theory, material science, and numerical simulation. Participants will gain a conceptual understanding of how these disciplines interact to address and overcome industry-specific difficulties.
【 IC Packaging Computer-Assisted Analysis Operation Course 】
Lecturer: Mr. Goran Liu
Master, Mechanical Engineering, National Cheng Kong University
Senior Technical Manager, Moldex3D (CoreTech System Co., Ltd.)
Area: Injection Molding Analysis/IC Packaging Stress Simulation/Warpage Simulation/IC Packaging Process Defect/Countermeasures
Description
This session starts with the IC package 2D design drawing to construct a 3D mesh, sets the package material parameters and process conditions, and then performs filling, curing, and warpage analysis.
The analysis results are used to illustrate common defects in packaging and to propose design change and improvement directions.